Package structure for surface acoustic wave device, and...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S31300R, C310S348000

Reexamination Certificate

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07436105

ABSTRACT:
A package structure realizing a size and/or thickness reduction and suitable for packaging a surface acoustic wave element is provided. The package structure for solving the above challenge includes a base having a thick floor16bon which to place a surface acoustic wave element12and a thin floor16aon which to place an electronic component14, the surface acoustic wave element and the electronic component being mounted close to each other on the plane coordinate system. In addition, in the package structure described above, the difference in height between the thin floor16aand the thick floor16bis the same as, or larger than, the thickness of the electronic component mounted on the thin floor16a.

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