Package structure for solid-state lighting devices and...

Details Package structure for solid-state lighting devices and... Package structure for solid-state lighting devices and...

2011-08-02

2011-08-02

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S048000, C438S054000, C438S069000, C438S029000, C438S026000, C257S431000, C257S448000, C257S078000, C257S294000, C257SE21388

Reexamination Certificate

active

07989237

ABSTRACT:
Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.

REFERENCES:
patent: 6531328 (2003-03-01), Chen
patent: 2004/0211970 (2004-10-01), Hayashimoto et al.
patent: 2006/0208271 (2006-09-01), Kim et al.

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