Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1993-07-06
1995-02-28
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257709, 257710, 257772, 257758, H01L 3902, H01L 2302, H01L 2312
Patent
active
053940113
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to a package structure used to air-tightly seal a semiconductor device by covering the same with a conductive cap, and a method of manufacturing such package structures, and more particularly to a multi-electrode leadless package structure, such as a hybrid IC, and an externally connecting electrode structure for an electronic part in a leadless package structure.
According to the present invention, a conductive layer is provided on the lower side of a circuit substrate on the upper surface of which a semiconductor element is mounted, and it is connected to a conductive seal member via conductive through holes, whereby a seal structure having both air-tightness and electromagnetic shielding characteristics is provided, and the present invention also provides an externally connecting electrode structure used for an electronic part in a leadless package structure and capable of carrying out a surface packaging operation smoothly by utilizing projections consisting of high-temperature solder.
BACKGROUND ART
In a semiconductor device (for example, a hybrid IC) in which various types of semiconductors are mounted, air-tight sealing is carried out for the purpose of shutting off the semiconductors from the outside air. In a semiconductor device in which oscillating modules are mounted on the same circuit substrate, the provision of electromagnetic shielding characteristics are also required in addition to the air-tight sealing characteristics.
A metal case sealed by a resistance welding method (Japanese Utility Model Laid-open No. 33482/1990) is generally known as a package structure having both the air-tight sealing characteristics and electromagnetic shielding characteristics as mentioned above.
This metal case consists of a combination of an external lead-retaining stem and a cap. In this metal case, a semiconductor device formed by setting a semiconductor element on a circuit substrate and bonding the former to the latter with a gold wire is fixed to a stem, and a cap is put on the resultant product so as to seal the same.
A package structure produced by forming a second conductive layer on an intermediate layer provided on a circuit substrate, putting a flangeless cap on the resultant product, and soldering the end surface of the outer circumferential portion of the circuit substrate to electrically connect the second conductive layer and cap together and electro-magnetically shield the product has also been proposed recently (Japanese Utility Model Laid-open No. 13796/ 1990).
In the former package structure out of these prior art package structures, a metal case (stem and cap) in which the circuit substrate is housed is required, and this necessarily causes the manufacturing cost and the weight of the product to increase. Moreover, a dedicated sealing apparatus is indispensable for the production of this package structure. Therefore, it is very difficult for this package structure to meet a demand, which has been made in recent years, to reduce the weight, height, length and width thereof.
The latter package structure is formed by merely putting a cap on the circuit substrate, so that the dimensions and weight thereof can be reduced. However, since the cap is soldered to the end surface of the circuit substrate, it is necessary to separate the circuit substrate into parts and seal the parts separately, so that the operation efficiency becomes low. Therefore, this package structure is not suitable for the mass production of the devices of this kind.
In an electronic part having a plurality of semiconductor elements mounted on a single substrate, and a plurality of external electrodes, such as a hybrid IC, it is important to miniaturize a package and reduce the packaging area (improve the packaging density). Although various package structures have been developed, a leadless package structure is basically most advantageous in order to reduce the packaging area (refer, for example, to Japanese Patent Laid-open No. 84681/1978).
Various structures of an external electr
REFERENCES:
patent: 3303392 (1967-02-01), Zelina
patent: 5147084 (1992-09-01), Behun et al.
patent: 5239198 (1993-08-01), Lin et al.
Katouno Masanori
Konuma Takayuki
Sato Kaori
Shika Akira
Suzuki Hiroyoshi
Fuji Electrochemical Co. Ltd.
Iwaki Electronics Co. Ltd.
Jackson Jerome
Monin D.
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