Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-10-02
2007-10-02
Tran, Minhloan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S098000, C257S099000, C257S100000, C257SE33056, C257SE33057, C257SE33058, C257SE33059
Reexamination Certificate
active
11011133
ABSTRACT:
A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and quality of package can be increased, and when packaging an LED chip, it easily meets the package requirements of an electronic chip. In addition, the substrate structure is cheaper than the prior art, because a double-layered substrate is employed to improve the strength, and the package structure is also preferred because an external frame device is additionally used for preventing interference by external light. The package structure for the semiconductor has a substrate, an external frame device and a polymer filler.
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Chuang Jonnie
Hung Chi-Wen
Lin Chuan-Fa
Wang Billy
Harvatek Corporation
Rodela Eduardo A.
Tran Minhloan
Troxell Law Office PLLC
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