Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-10-19
2009-10-27
Levi, Dameon E (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S807000, C361S679020
Reexamination Certificate
active
07609524
ABSTRACT:
A package structure for packaging a panel module. The panel module comprises at least a gap. The package structure comprises a base and a cover. The base comprises a first loading surface for loading the panel module and at least one first engaging portion corresponding to the gap. The cover comprises a first covering surface and a second engaging portion corresponding to the first engaging portion. The first engaging portion and the second engaging portion connect the first loading surface and the first covering surface.
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English Abstract of JP2004094256.
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Chang Wen-Yuan
Chen Shih-Chi
Ting Chung-Kuan
Wu Chia-Chung
AU Optronics Corp.
Levi Dameon E
Thomas Kayden Horstemeyer & Risley
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