Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-03-15
2011-03-15
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000
Reexamination Certificate
active
07906853
ABSTRACT:
A die module and method for assembling such a die module is provided. For example, present embodiments include providing a substrate and coupling a first sub-stack to the substrate, wherein the first sub-stack includes two or more die arranged in a first shingle stack configuration relative to one another such that an upper portion of each die in the first sub-stack is accessible, the first shingle stack configuration having a first skew. Further, present embodiments include stacking a second sub-stack on top of the first sub-stack, wherein the second sub-stack includes two or more die arranged in a second shingle stack configuration relative to one another such that an upper portion of each die in the second sub-stack is accessible, the second shingle stack configuration having a second skew that is different than the first skew.
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Andújar Leonardo
Fletcher Yoder
Micro)n Technology, Inc.
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