Package structure for mounting a field emitting device in an...

Details Package structure for mounting a field emitting device in an... Package structure for mounting a field emitting device in an...

2005-01-11

2005-01-11

Williams, Joseph (Department: 2879)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

C445S067000

Reexamination Certificate

active

06840834

ABSTRACT:
Apparatus and method are provided for a package structure that enables mounting of a field-emitting cathode into an electron gun. A non-conducting substrate has the cathode attached and the cathode is electrically connected to a pin through the substrate. Other pins are electrically connected to electrodes integral with the cathode. Three cathodes may be mounted on a die flag region to form an electron gun suitable for color CRTs. Accurate alignment of an emitter array to the apertures in the electron gun and other electrodes such as a focusing lens is achieved. The single package design may be used for many gun sizes. Assembly and attachment of the emitter array to the electron gun during construction of the gun can lower cost of construction.

REFERENCES:
patent: 4414485 (1983-11-01), Marschka
patent: 5869924 (1999-02-01), Kim
patent: 5898262 (1999-04-01), Kim et al.
patent: 5905332 (1999-05-01), Yun et al.
D.E. Patterson, et al., “Advanced CVD Diamond Microtip Device for Extreme Applications”,Mat. Res. Soc. Symp. Proc.vol. 509 (1998) pp. 65-75. no month.

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