Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-09-08
2004-10-05
Gibson, Randy W. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S693000, C361S689000, C257S704000, C257S702000, C174S050510
Reexamination Certificate
active
06801429
ABSTRACT:
CROSS REFERENCE TO RELATED APPLICATIONS
This application claims the priority benefit of Taiwan application serial no. 92103999, filed on Feb. 26, 2003.
BACKGROUND OF INVENTION
1. Field of Invention
The present invention relates to a package structure. More particularly, the present invention relates to a package structure compatible with a cooling system.
2. Description of Related Art
In an information-explosion world, ICs are widely used in the daily life, including entertainment, education, transportation and households. The design of the electrical products becomes more complex and high-speed and multi-function chips are developed. As the integration of ICs keeps increasing and the layout of the high-speed semiconductor devices becomes dense, more heat is generated by the semiconductor device per unit area in a certain period. Thus, it is important for the design of semiconductor devices to consider the heat dissipation issue, in order to prevent damages to the electronic devices or the chips.
FIG. 1
is a cross-sectional view of a prior art wiring package structure. A chip
140
is arranged on a carrier
100
having a first surface
102
and a second surface
104
. A die pad
110
and a plurality of pads
120
are disposed on the first surface
102
, while a plurality of ball pads
130
are disposed on the second surface
104
. A plurality of bonding pads
146
is disposed on an active surface
142
of the chip
140
, and a back surface
144
of the chip
140
is attached to the die pad
110
through silver paste
150
. Each bonding pad
146
is electrically connected to one of the pads
120
through a gold wire
160
, thus electrically connecting the chip
140
with the carrier
100
.
A mold compound
170
covers the chip
140
, the gold wires
160
and the first surface
102
of the carrier
100
for protecting the chip
140
and the gold wires
160
. A heat dissipation plate
180
, for dissipating heat from the operation of the chip
140
, is disposed on the outer surface of the mold compound
170
.
In theory, the heat dissipation plate
180
can help dissipate heat generated from the operation of the chip
140
into the exterior of the mold compound. However, as discussed above, as the package becomes minimized and chip per unit area generates more heat in a certain period, it is unlikely to rely on the heat dissipation plate alone to dissipate all the heat. Therefore, the un-dissipated heat can cause serious damages to the electronic devices on the active surface of the chip. In fact, inefficient heat dissipation can cause quite a few problems, including: (1) the un-dissipated heat results in higher resistance for the current of the electronic device, thus influencing the signal transmission (signal delay) or giving rise to error signals; and (2) the un-dissipated heat deteriorate the performance of the electronic device, even shortening the life of the electronic device on the chip.
SUMMARY OF INVENTION
The present invention provides a package structure compatible with a cooling system, which can efficiently dissipate heat.
As embodied and broadly described herein, the present invention provides a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electrically connected to the carrier, while the mold compound covers the chip and one surface of the carrier. The cooling tubule is disposed either within the mold compound or on an outer surface of the mold compound. The cooling tubule is connected to a cooling tubing of the cooling system and a fluid driven by a pump circulates in the cooling tubing and the cooling tubule for heat dissipation.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
REFERENCES:
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 5291064 (1994-03-01), Kurokawa
patent: 5696405 (1997-12-01), Weld
patent: 6263957 (2001-07-01), Chen et al.
patent: 6437437 (2002-08-01), Zuo et al.
Peng Sheng-Yang
Tsai Tsung-Yueh
Advanced Semiconductor Engineering Inc.
Bui Hung S.
Gibson Randy W.
Jiang Chyun IP Office
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