Package structure and manufacturing method thereof

Details Package structure and manufacturing method thereof Package structure and manufacturing method thereof

2009-11-10

2011-11-15

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S107000, C438S667000, C438S698000

Reexamination Certificate

active

08058102

ABSTRACT:
The present invention discloses a semiconductor device package structure with redistribution layer (RDL) and through silicon via (TSV) techniques. The package structure comprises an electronic element which includes a dielectric layer on a backside surface of the electronic element, a plurality of first conductive through vias across through the electronic element and the dielectric layer, and a plurality of conductive pads accompanying the first conductive through vias on an active surface of the electronic element; a filler material disposed adjacent to the electronic element; a first redistribution layer disposed over the dielectric layer and the filler material, and connected to the first conductive through vias; a first protective layer disposed over the active surface of the electronic element, the conductive pads, and the filler material; and a second protective layer disposed over the redistribution layer, the dielectric layer, and the filler material.

REFERENCES:
patent: 2010/0301474 (2010-12-01), Yang
patent: 2011/0042798 (2011-02-01), Pagaila et al.

Affiliated with

Also associated with

Rating

Package structure and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package structure and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package structure and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4310431