Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-07-07
2009-06-23
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S723000, C174S255000
Reexamination Certificate
active
07551455
ABSTRACT:
A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.
REFERENCES:
patent: 4730241 (1988-03-01), Takaya
patent: 5847951 (1998-12-01), Brown et al.
patent: 6395992 (2002-05-01), Nakayama et al.
patent: 6512680 (2003-01-01), Harada et al.
patent: 6911353 (2005-06-01), Tani et al.
patent: 6940724 (2005-09-01), Divakar et al.
patent: 2004/0090759 (2004-05-01), Kim
patent: 2006/0139902 (2006-06-01), Happoya
patent: 2007/0176278 (2007-08-01), Wang
patent: 2008/0211082 (2008-09-01), Hirashima et al.
patent: 1458691 (2003-11-01), None
patent: 2696284 (2005-04-01), None
patent: 1674276 (2005-09-01), None
patent: 480631 (2002-03-01), None
patent: 544880 (2003-08-01), None
patent: 1234213 (2005-06-01), None
patent: 1244146 (2005-11-01), None
patent: 1246750 (2006-01-01), None
Chen Da-Jung
Fang Yi-Min
Lin Yi-Cheng
Liu Chun-Tiao
Lu Bau-Ru
Cyntec Co., Ltd.
J.C. Patents
Reichard Dean A.
Semenenko Yuriy
LandOfFree
Package structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Package structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4123804