Package structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S723000, C174S255000

Reexamination Certificate

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07551455

ABSTRACT:
A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

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patent: 2004/0090759 (2004-05-01), Kim
patent: 2006/0139902 (2006-06-01), Happoya
patent: 2007/0176278 (2007-08-01), Wang
patent: 2008/0211082 (2008-09-01), Hirashima et al.
patent: 1458691 (2003-11-01), None
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patent: 1674276 (2005-09-01), None
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patent: 544880 (2003-08-01), None
patent: 1234213 (2005-06-01), None
patent: 1244146 (2005-11-01), None
patent: 1246750 (2006-01-01), None

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