Package stack via bottom leaded plastic (BLP) packaging

Details Package stack via bottom leaded plastic (BLP) packaging Package stack via bottom leaded plastic (BLP) packaging

1999-06-21

2000-11-14

Nelms, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

257666, H01L 2144

Patent

active

06146919&

ABSTRACT:
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

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