Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1999-06-21
2000-12-26
Kincaid, Kristine
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257686, 257693, 257778, H01L 2302
Patent
active
06166328&
ABSTRACT:
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.
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Samsung DRAM Web Page, High Density DRAMs, 2 pages. No date.
Kincaid Kristine
Micro)n Technology, Inc.
Ngo Hung V
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