Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1999-04-14
2000-12-26
Witkowski, Stanley J.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 91, 174260, 174263, 361767, 361772, H01R 1204, H01R 1216, H05K 100
Patent
active
061649813
ABSTRACT:
A package socket system includes a positioning frame positioned on a circuit board. The positioning frame has an interior space defined between four side walls for receiving and accommodating a BGA socket that retains an array of contacts therein. The contacts have a lower ball end in contact engagement with and supported on conductive pads of the circuit board. A BGA package having an array of solder balls is received in the positioning frame and supported on the socket with the solder balls received in flared upper ends of the contacts of the socket. A heat sink has a flat base supported on the positioning frame and secured to the substrate to establish a firm contact engagement with the package thereby securely maintaining the package and the socket in position on the substrate. The positioning frame has a chamfered section and the socket and the package each have a corresponding chamfered corner for positioning purposes.
REFERENCES:
patent: 4417777 (1983-11-01), Bamford
patent: 5641297 (1997-06-01), Kozel
patent: 5641945 (1997-06-01), Abe et al.
patent: 5669774 (1997-09-01), Grabbe
patent: 5716222 (1998-02-01), Murphy
patent: 5746608 (1998-05-01), Taylor
patent: 5766021 (1998-06-01), Pickles et al.
Lin Cheng-Hung
Lin Nick
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Witkowski Stanley J.
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