Package semiconductor device using chalcogenide glass sealing

Details Package semiconductor device using chalcogenide glass sealing Package semiconductor device using chalcogenide glass sealing

1983-09-08

1990-09-04

Carroll, J.

Pulse or digital communications

Repeaters

Testing

375 2, 375 73, 375 80, H01L 4500, H01L 2330, H01L 2302, H01L 3902

Patent

active

049548743

ABSTRACT:
A semiconductor device includes a package hermetically sealed with a chalcogenide-based glass sealing agent. A semiconductor element is housed within the package, and the respective electrodes of the semiconductor element are connected through bonding wires to leads extending to the outside of the package.

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A. R. Hilton et al, "Non-Oxide IVA-VAI Chalcogenide Glasses, Part I, Glass-Forming Regions and Variations in Physical Properties", Physics and Chemistry of Glasses, vol. 7 (1966), pp. 105-112.
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