Package semiconductor chip

Details Package semiconductor chip Package semiconductor chip

1988-02-19

1989-08-29

Wojciechowicz, Edward J.

357 68, 357 71, 357 72, 357 80, 357 81, 357 84, H01L 2348

Patent

active

048622451

ABSTRACT:
The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably by means of an alpha barrier. The conductors cover a substantial portion of the surface of the chip and thereby serve as conduits for the dissipation of heat from the chip. Wires are bonded to the conductors and extend from the conductors to the terminals on the semiconductor chip. In a preferred embodiment the semiconductor chip terminals are located along a center line of the chip. This allows for short connecting wires which in turn contribute to faster chip response.

REFERENCES:
patent: 3959579 (1976-05-01), Johnson
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4494217 (1985-01-01), Suzuki et al.
Semiconductor International, Sep. 1982, pp. 111-124.
Semiconductor International, Apr. 1985.
Hitachi Cable, Ltd. DaiNippon.
Tamagawa Metal & Machinery Co., Ltd.

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