Package retention module coupled directly to a socket

Details Package retention module coupled directly to a socket Package retention module coupled directly to a socket

2001-09-28

2003-07-29

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C024S458000, C257S719000, C361S719000

Reexamination Certificate

active

06600652

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a retention module for retaining a heat sink to a package assembly. More particularly, the present invention relates to a package assembly retention module that is coupled directly to a socket.
2. Discussion of the Related Art
A heat sink is usually placed in contact with an electronic device, such as a Central Processing Unit (CPU), for removing heat therefrom. For higher-power devices, an integrated heat spreader (IHS) lid is generally placed between the heat sink and the electronic device to facilitate cooling the device. The electronic device is often mounted on a socket that couples to the motherboard. Various retention modules have been used for maintaining intimate contact between the heat sink and the IHS lid, or the bare package.
As shown in
FIG. 5
, a typical retention module is attached to the motherboard
150
, often by passing the retention module through a motherboard hole
520
that is drilled into the motherboard
150
outside the perimeter of the socket
130
that couples to the motherboard
150
. Drilling motherboard holes
520
takes up valuable space on the motherboard
150
, approximately 25-50% more area than the socket
130
alone, thereby increasing the price of the motherboard
150
. Furthermore, the area occupied by the motherboard holes
520
is close to a package
230
, a space highly desirable to design engineers to place capacitors, voltage regulators, and other electrical components to optimize performance of the package
230
. Holes are generally drilled into the heat sink
210
as well, so that the retention module may also pass through the heat sink
210
. The heat sink
210
must extend outside the perimeter of the socket
130
that couples to the motherboard
150
to provide sufficient space for the retention module
100
to pass through. Fasteners
530
, such as clamps, screws, or nuts, are then coupled to the ends of the retention module to ensure a secure contact between the heat sink
210
and the IHS lid
220
or the package
230
. A tool is required to apply the fasteners
530
, which makes the assembly procedure more complicated.
Furthermore, having separate retention modules may give rise to inventory issues and increase both the cost of the package system and the number of piece parts. Although typical retention modules may be required to support the large heat sinks generally required in servers, the use of such retention modules may often be unnecessary and add cost in lower-power systems.
Thus, a retention module that requires neither additional motherboard space nor modifications to the motherboard is required.


REFERENCES:
patent: 4547031 (1985-10-01), Korsunsky
patent: 5448449 (1995-09-01), Bright et al.
patent: 5671118 (1997-09-01), Blomquist
patent: 5761036 (1998-06-01), Hopfer et al.
patent: 5777852 (1998-07-01), Bell
patent: 5870287 (1999-02-01), Rodriguez et al.
patent: 6175499 (2001-01-01), Adams et al.
patent: 6249436 (2001-06-01), Bollesen
patent: 6250375 (2001-06-01), Lee
patent: 6347036 (2002-02-01), Yeager et al.

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