Package removal for FBGA devices

Details Package removal for FBGA devices Package removal for FBGA devices

1998-12-09

2000-10-03

Thomas, Tom

Semiconductor device manufacturing: process

With measuring or testing

438 4, 438 8, 438 12, 438 71, 438691, 438689, 257 48, G01R 3126

Patent

active

061271942

ABSTRACT:
Aspects for removing device packaging from an FBGA (fine pitch ball grid array) package are described. In an exemplary method aspect, the method includes recessing a predetermined area of the FBGA package, and exposing an integrated circuit die covered by the FBGA package. Device analysis is then performed on the exposed die. The step of recessing further includes milling the predetermined area, while the step of exposing includes chemically etching the FBGA package.

REFERENCES:
patent: 5650593 (1997-07-01), McMillan et al.
patent: 5861662 (1999-01-01), Candelore

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