Package providing high heat dissipation, in particular for micro

Details Package providing high heat dissipation, in particular for micro Package providing high heat dissipation, in particular for micro

1984-01-03

1986-01-07

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 420502, 420507, 420558, 420566, H01L 2310

Patent

active

045635412

ABSTRACT:
A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means of insulating lead-in bushings of the glass bead type. The coefficient of expansion of the frame and of the base are matched so as to ensure that the base of the package does not exhibit any defect of surface planarity after cooling.

REFERENCES:
patent: 4266089 (1981-05-01), Scherer
patent: 4266090 (1981-05-01), Scherer
patent: 4361720 (1982-11-01), Resneau et al.
patent: 4451540 (1984-05-01), Baird et al.

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