Image analysis – Applications – Personnel identification
Reexamination Certificate
2007-09-19
2011-11-01
Liew, Alex (Department: 2624)
Image analysis
Applications
Personnel identification
Reexamination Certificate
active
08050467
ABSTRACT:
A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer.
REFERENCES:
patent: 6330145 (2001-12-01), Lepert et al.
patent: 6437583 (2002-08-01), Tartagni et al.
patent: 2001/0026636 (2001-10-01), Mainguet
patent: 2003/0035570 (2003-02-01), Benkley, III
Chen Tun-Yu
Chen Yeh-Shun
Chen Yung-Jen
Chu Wei-Te
Yang Charles
Chipbond Technology Corporation
Liew Alex
Muncy Geissler Olds & Lowe, PLLC
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