Package-on-package system with internal stacking module...

Details Package-on-package system with internal stacking module... Package-on-package system with internal stacking module...

2011-03-08

2011-03-08

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000, C438S613000, C257S686000, C257S737000, C257S787000, C257SE25013

Reexamination Certificate

active

07901987

ABSTRACT:
A package-on-package system includes: forming a first integrated circuit package including second top electrical contacts and first external electrical contacts on opposite sides thereof; forming an internal stacking module interposer including first top electrical contacts and base electrical connectors on opposite sides thereof; attaching the internal stacking module interposer to the first integrated circuit package with the first top electrical contacts connected to the second top electrical contacts; and molding a package encapsulant over the first integrated circuit package and around the internal stacking module interposer leaving a package encapsulant cavity for attaching a stacked package to the base electrical connectors.

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Mutschler, Ann S., STATS ChipPAC's fan-in package-on-package drives functional integration, EDN (Electronics Design, Strategy, News), Mar. 26, 2007, http://www.edn.com/index.asp?layout=article&articleid=CA6427767.
Die Stacking, http://www.siliconfareast.com/diestacking.htm.

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