Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1974-04-29
1977-05-24
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29589, 29591, 29627, 357 17, B01J 1700
Patent
active
040246272
ABSTRACT:
Packaging of electronic chips, such as light emitting diodes and the like, without the use of conventional flying leads and ultrasonic bonding is disclosed. The subject packaging and mounting of electronic chips is primarily intended for use with flat flexible cables and similar circuitry which is printed onto flexible insulator substrates. A portion of the circuitry on the insulator substrate is broken by a sharp instrument to form a break or slot in both the conductor and substrate. An electronic chip, such as a light emitting diode, is inserted edge wise into the slot with the opposing surfaces thereof in contact with the conductor of the circuit on either side of the slot. The mechanical friction between the chip and the edges of the slot are sufficient to hold the chip in place while maintaining satisfactory electrical contact.However, the chip can be bonded to the circuit by any known means including solder reflow, conductive epoxys and encapsulation with suitable material.
REFERENCES:
patent: 2869040 (1959-01-01), Pifer
patent: 2988661 (1961-06-01), Goodman
patent: 3049647 (1962-08-01), Lincoln
patent: 3159775 (1964-12-01), Ingr aham
patent: 3818279 (1974-06-01), Seeger
AMP Incorporated
Egan Russell J.
Tupman W.
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