Package modification for channel-routed circuit boards

Details Package modification for channel-routed circuit boards Package modification for channel-routed circuit boards

2005-08-30

2005-08-30

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C029S835000, C029S837000

Reexamination Certificate

active

06936502

ABSTRACT:
A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vias penetrating at least one layer of the circuit board and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board. The method comprises the step of forming at least one pin of the plurality of pins of the circuit component to have a length compatible with a depth of a corresponding via of the circuit board.

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patent: 2003/0196831 (2003-10-01), Momokawa

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