Package method of micro-electro-mechanical system chip

Details Package method of micro-electro-mechanical system chip Package method of micro-electro-mechanical system chip

2011-08-02

2011-08-02

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S106000, C438S456000, C438S689000

Reexamination Certificate

active

07989246

ABSTRACT:
The present invention proposes a MEMS chip and a package method thereof. The package method comprises; making a capping wafer by: providing a first substrate and forming an etch stop layer on the first substrate; making a device wafer by: providing a second substrate and forming a MEMS device and a material layer surrounding the MEMS device on the second substrate; bonding the capping wafer and the device wafer; after bonding, etching the first substrate to form at least one via; etching the etch stop layer through the via; etch the material layer; and forming a sealing layer on the first substrate.

REFERENCES:
patent: 6514789 (2003-02-01), Denton et al.
patent: 6872319 (2005-03-01), Tsai
patent: 7049164 (2006-05-01), Bruner
patent: 2004/0077154 (2004-04-01), Nagarajan et al.
patent: 2005/0009246 (2005-01-01), Enquist et al.
patent: 2007/0048898 (2007-03-01), Carlson et al.

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