Package method of inkjet-printhead chip and its structure

Details Package method of inkjet-printhead chip and its structure Package method of inkjet-printhead chip and its structure

2011-06-07

2011-06-07

Nguyen, Lamson D (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C029S890100

Reexamination Certificate

active

07954924

ABSTRACT:
The present invention discloses a package method of the inkjet-printhead chip and its structure. The structure includes: a nozzle structure of a print element including an ink chamber layer and a nozzle layer on the ink chamber layer, wherein a plurality of nozzle through holes are set in the nozzle layer and pass through an ink chamber of the ink chamber layer; a flexible substrate set on the nozzle layer, wherein there is at least an opening set in the flexible substrate to expose those nozzle through holes; and a chip set under the ink chamber layer. Besides, the present package method is to utilize the micro-manufacturing process to form the nozzle structure of a print element and the tape automatic bonding process to bond the flexible substrate on the nozzle layer and the chip under the ink chamber layer.

REFERENCES:
patent: 7475964 (2009-01-01), Benson et al.
patent: 7744194 (2010-06-01), Yokouchi

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