Package in the heat dissipation of Electronic devices

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165185, 174 163, H05K 720

Patent

active

049997416

ABSTRACT:
Many housings for electronic devices require to be carefully sealed, as well as incorporate heat sinks for the electronic devices. Careful sealing has required expensive machined housing joints and, because electronic devices may be misaligned to the substrate, rounded heat sinks have been used, giving restricted contact areas and hence limited cooling. The invention employs a thermally conducting flexible membrane capable of being urged into thermal contact with the electronic device, for example by a evacuation of the housing, thereby permitting a simple hermetic seal as well as contact with the electronic device over a large area.

REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4381032 (1983-04-01), Cutchaw
patent: 4602314 (1986-07-01), Broadbent
patent: 4654754 (1987-03-01), Daszkowski
patent: 4689720 (1987-08-01), Daszkowski
patent: 4744008 (1988-05-01), Black
patent: 4755249 (1988-07-01), DeGree
"Module-Thermal Resistance", Arnold, IBM Tech Discl. Bull., vol. 21, No. 4, Sep. 78, pp. 1473,4 (361-387).
"Thermally Enhanced-Structure", Coughlin, IBM Tech Disc Bull, vol. 2, No. 1, Jun. 1978, pp. 185 (361/387).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Package in the heat dissipation of Electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package in the heat dissipation of Electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package in the heat dissipation of Electronic devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-452102

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.