Package having bond-sealed underbump

Details Package having bond-sealed underbump Package having bond-sealed underbump

2006-06-27

2006-06-27

Ho, Tu-Tu (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C257S680000, C257S433000, C257S704000

Reexamination Certificate

active

07067355

ABSTRACT:
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

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