Package having a heat sink suitable for a ceramic substrate

Details Package having a heat sink suitable for a ceramic substrate Package having a heat sink suitable for a ceramic substrate

1986-06-17

1987-10-27

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 174 16HS, 420528, 420548, 165905, H01L 2336, C22C 2102

Patent

active

047033398

ABSTRACT:
A package including a heat sink especially suitable for a ceramic substrate is disclosed. The heat sink is formed of aluminum-silicon alloy material and is fixed to a surface of the ceramic substrate opposing a second surface on which at least one heat generating component is mounted.

REFERENCES:
patent: 3117175 (1964-01-01), Kohlmeyer
patent: 3480411 (1969-11-01), Pryor
patent: 3536123 (1970-10-01), Izumi
patent: 3980537 (1976-09-01), McMinn et al.
patent: 4113473 (1978-09-01), Gauvry et al.
patent: 4611238 (1986-09-01), Lewis et al.

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