Package for water-scale semiconductor devices

Details Package for water-scale semiconductor devices Package for water-scale semiconductor devices

1986-04-03

1987-12-29

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

295691, 357 66, 361387, H01L 2312, H01L 2314

Patent

active

047151153

ABSTRACT:
The invention is a method of packaging whole or large silicon wafers that provides support for the wafer, eliminates thermally or package-induced wafer strain, and allows selection of a mounting substrate material that provides optimal heat conduction.

REFERENCES:
Van Vestrout, "Floating Backbond Mounting", IBM Technical Discl. Bulletin, vol. 16, No. 3, p. 766, 8/1973.
"Wafer Scale Integration: An Appraisal", by Ron Iscoff, West Coast Editor, Semiconductor International; Sep. 1984, pp. 62-65.
"Wafer Scale Integration: The Limits of VLSI?", by Douglas L. Peltzer, Trilogy Systems Corp., VLSI Design, Sep. 1983, pp. 43-47.

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