Package for very large scale integrated circuit

Details Package for very large scale integrated circuit Package for very large scale integrated circuit

1988-09-29

1991-01-01

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

333 33, 357 51, 357 74, 361401, 361414, H05K 720

Patent

active

049823116

ABSTRACT:
A package (10) for very large scale integrated circuit (VLSI) includes an electrically and thermally conductive tagboard (20) carrying the chip (12); supply terminals (15a) receiving a first supply potential; an interconnect structure (16) made of ceramic which surrounds the chip (12) and carries both the signal terminals (14) of the package (10) and the supply terminals (15b) receiving a second supply potential, the interconnect structure (16) incorporating the signal and supply conductors intended for the chip (12); and a decoupling device (17) including capacitors (19) and two conductor faces (18a, 18b) connected respectively to the supply terminals (15a, 15b). The decoupling by the capicitors (19) is thus done as close as possible to the conductor faces (18a and 18b) and as close as possible to the chip (12) at the level of islets (32a, 32b).

REFERENCES:
patent: 4249196 (1981-02-01), Durney
patent: 4577214 (1986-03-01), Schaper
patent: 4654694 (1987-03-01), Val
patent: 4724472 (1988-02-01), Sugimoto
patent: 4744008 (1988-05-01), Black
patent: 4755910 (1988-07-01), Val

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