Package for very high frequency integrated circuits

Wave transmission lines and networks – Long line elements and components – Strip type

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Details

333247, 357 74, H01P 100

Patent

active

050217593

ABSTRACT:
Package for a very high frequency integrated circuit comprising a housing provided with a recess whose bottom is metallized and provided with peripheral connectors, and including a connection device inserted in the recess between the integrated circuit and the connectors, this connection device including a substrate that presents an upper surface comprising microstrip lines to connect contact studs of the integrated circuit to the connectors of the housing and a metallized lower surface to form a ground plane. The housing comprises two parts fastened to each other, the first or peripheral part accommodating the connectors, a first zone of the connection device and a chamber provided in the recess, of which chamber the dimensions are independent of those of the integrated circuit to be protected, and which is suitable for accommodating, the second or central part, the latter accommodating the integrated circuit and a second zone of the connection device termed complementary zone, whose dimensions depend on those of the integrated circuit to be protected, so as to come as near to the latter as possible, in a manner such that the length of the connector wires between the microstrip lines and the studs of the integrated circuit is the smallest possible.

REFERENCES:
patent: 3943469 (1976-03-01), Kawamoto et al.
patent: 4259684 (1981-03-01), Dean et al.
patent: 4768004 (1988-08-01), Wilson
patent: 4881764 (1989-07-01), Usui

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