Package for surface mounted components

Details Package for surface mounted components Package for surface mounted components

1989-08-11

1991-07-30

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

361396, 361406, 361414, H05K 114

Patent

active

050364316

ABSTRACT:
A package for surface-mounted components according to the present invention includes a first board which includes contact portions formed on a front face side thereof for mounting the components to be surface-mounted thereon, and first through-holes electrically contiguous with the contact portions; a second board includes conductor pins provided on a rear face side thereof for establishing continuity with another board and second through-holes electrically contiguous with the conductor pins; and a conductor layer interposed between the first and second boards by which the first through-holes in the first board side and the second through-holes in the second board side are mutually electrically connected.

REFERENCES:
patent: 3323022 (1967-05-01), DaCosta
patent: 3730969 (1973-05-01), Buttle et al.
patent: 3805117 (1974-04-01), Hausman
patent: 3832603 (1974-08-01), Cray et al.
patent: 3999105 (1976-12-01), Archey et al.
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patent: 4736521 (1988-04-01), Dohya
patent: 4744007 (1988-05-01), Watari et al.
patent: 4754371 (1988-06-01), Nitta et al.
patent: 4803450 (1989-02-01), Burgess et al.
Tomsa et al., Multilayer Laminated Chip Carrier, IBM Tech. Disc. Bull., Vol. 21, #4, Sep. 1978, pp. 1396 and 1397.

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