Package for superconducting devices

Details Package for superconducting devices Package for superconducting devices

1989-10-30

1990-12-25

Carroll, J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 81, 361385, 174154, H01L 3902, H01L 2302, H01L 2504

Patent

active

049807544

ABSTRACT:
A package for superconducting devices, enabling signal transmission at a small propagation delay between superconducting devices provided within a heat insulating vacuum vessel, and semiconductor devices provided outside the heat insulating vacuum vessel. The package comprises a heat insulating vacuum vessel capable of maintaining the interior thereof at a low temperature, a substrate having mounted thereon superconducting devices and disposed within the heat insulating vacuum vessel, another substrate having mounted thereon semiconductor devices and disposed outside the heat insulating vacuum vessel, and film cables electrically connecting the respective circuit patterns of these substrates. Since the thickness of the film cables are very small, the rate of influx of heat that flows into the heat insulating vacuum vessel can be limited to a low value.

REFERENCES:
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4734820 (1988-03-01), Lauffer et al.
patent: 4805420 (1989-02-01), Porter et al.
Popular Electronics (Apr. 1967); pp. 85, 106.
IBM Technical Disclosure Bulletin, vol. 18, No. 4, Sep. 1975; "Close-Cycle Liquid Nitrogen Refrigeration System for Low-Temperature Computer Operation"; by V. L. Rideout; pp. 1226-1229.
IEEE Spectrum, May 1979, "Computing at 4 Degrees Kelvin", By: Dr. Wilhelm Anacker.

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