1983-10-31
1988-07-26
Sikes, William L.
357 75, H01L 2302, H01L 2312
Patent
active
047604409
ABSTRACT:
A package for solid state image sensor devices, such as CCD image sensors, includes a base plate on which a plurality of the image sensor devices are mounted in end-to-end abutting relation with the detector arrays of the image sensors being over an opening in the base plate, and a cover mounted on the base plate and extending over the image sensor devices to enclose the image sensor devices between the cover and the base plate. The base plate and cover are of polycrystalline silicon so as to have a coefficient of thermal expansion which matches that of the image sensor devices.
REFERENCES:
patent: 3593070 (1971-07-01), Reed
patent: 4326214 (1982-04-01), Trueblood
patent: 4406054 (1983-09-01), St. Louis
patent: 4482781 (1984-11-01), Burns
Bigler Robert R.
Goldfarb Samuel
Davis Jr. James C.
General Electric Company
Sikes William L.
Squire William
Webb II Paul R.
LandOfFree
Package for solid state image sensors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Package for solid state image sensors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for solid state image sensors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-260937