Package for solid state image sensors

Patent

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Details

357 75, H01L 2302, H01L 2312

Patent

active

047604409

ABSTRACT:
A package for solid state image sensor devices, such as CCD image sensors, includes a base plate on which a plurality of the image sensor devices are mounted in end-to-end abutting relation with the detector arrays of the image sensors being over an opening in the base plate, and a cover mounted on the base plate and extending over the image sensor devices to enclose the image sensor devices between the cover and the base plate. The base plate and cover are of polycrystalline silicon so as to have a coefficient of thermal expansion which matches that of the image sensor devices.

REFERENCES:
patent: 3593070 (1971-07-01), Reed
patent: 4326214 (1982-04-01), Trueblood
patent: 4406054 (1983-09-01), St. Louis
patent: 4482781 (1984-11-01), Burns

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