Package for semiconductor wafers

Special receptacle or package – For plate or sheet – Fragile or sensitive

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

206334, 206449, B65D 8548

Patent

active

047934883

ABSTRACT:
A sealable contamination proof container package bottom and top for storing and transporting a plurality of silicon wafers in a wafer carrier. The package bottom includes four sides, a continuous vertical surface for tape sealing surrounding the four sides, a lip positioned on a vertical edge, opposing hook latches on opposing sides, opposing hand grip recesses on the opposing sides and a raised bottom surface for package stacking. The package top includes four sides, a continuous vertical surface for tape sealing surrounding the four sides, a lip positioned on the vertical surface, opposing hook catches on the opposing side, a top surface with a raised stacking surface, a plurality of transparent inspection windows on the top surface, and two rows of wafer springs positioned on the underside of the top surface. The package top and bottom halves provide that a carrier mates between the package top and package bottom with the wafers in the carrier. The package top and bottom mate with the upper lip engaged against the lower lip, and the catches of the top engage with the latches of the bottom. In opening, the top package half is moved in a direction coinciding to the plane of the wafers with respect to positioning of the catches and latches on the package side. The raised top portion of the top package half and the recessed bottom of the bottom package half provides for stacking of like packages.

REFERENCES:
patent: 4043451 (1977-08-01), Johnson
patent: 4061228 (1977-12-01), Johnson
patent: 4160504 (1979-03-01), Kudlich et al.
patent: 4450960 (1984-05-01), Johnson
patent: 4490087 (1984-12-01), Ryan et al.
patent: 4520925 (1985-06-01), Johnson
patent: 4555024 (1985-11-01), Voss et al.
patent: 4557382 (1985-12-01), Johnson
patent: 4588086 (1986-05-01), Coe
patent: 4669612 (1987-06-01), Mortensen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Package for semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for semiconductor wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-863229

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.