Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1980-11-28
1982-05-25
Reynolds, B. A.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 70, 357 81, H05K 106
Patent
active
043318312
ABSTRACT:
A plastic encapsulation of the chip carrier type for a semiconductor integrated circuit is described. The package includes a lead frame member formed from a continuous metal tape which permits reel-to-reel automatic processing. The lead frame member provides the entire means for connecting from electrodes on the active or front surface of the semiconductor chip to contact members external to the encapsulation. The lead frame member also includes integral backside contact members providing electrical and thermal contact to the back surface of the semiconductor chip. The backside contact members similarly are integral with contact members external to the encapsulation. The interconnected structure including the lead frame member and semiconductor chip is housed in a molded plastic encapsulation. The package is capable of very small dimensions and is adapted for a high degree of automatic fabrication, including handling in stick-type magazines for subsequent operations such as testing, aging, and assembly.
REFERENCES:
patent: 3859718 (1975-01-01), Noe
patent: 3930114 (1975-12-01), Hodge
patent: 3968563 (1976-07-01), Hamlin
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4210926 (1980-07-01), Hacke
patent: 4214120 (1980-07-01), Jones et al.
"Automated Tape Carrier Bonding for Hybrids", R. G. Oswald et al., Solid State Technology, vol. 21, No. 3, Mar. 1978, pp. 39-48.
"Metallurgical Considerations for Beam Tape Assembly", A. S. Rose et al., Solid State Technology, vol. 21, No. 3, Mar. 1978, pp. 49-52.
"Beam Tape Carriers-A Design Guide", R. L. Cain, Solid State Technology, vol. 21, No. 3, Mar. 1978, pp. 53-58.
"Packaging Technology Responds to the Demand for Higher Densities", J. Lyman, Electronics, Sep. 28, 1978, pp. 117-125.
"BTAB's Future-An Optimistic Prognosis", R. F. Unger et al., Solid State Technology, Mar. 1980, pp. 77-83.
Ingram Arthur J.
Weingrod Irving
Bell Telephone Laboratories Incorporated
Lockhart H. W.
Reynolds B. A.
Tone D. A.
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