Package for semiconductor device having radiating substrate...

Details Package for semiconductor device having radiating substrate... Package for semiconductor device having radiating substrate...

2000-07-18

2003-01-28

Schuberg, Darren (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S707000, C165S080300, C257S706000, C174S050510

Reexamination Certificate

active

06512674

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a package for a semiconductor device (hereinafter called PKG), particularly relates to PKG having a radiating substrate provided with a chip mounting part for directly mounting a semiconductor chip (hereinafter called a chip).
2. Description of the Related Art
Heretofore, this type of PKG has been formed by brazing a ceramic side wall for airtightly sealing a chip directly mounted on a chip mounting part of a radiating substrate.
FIG. 8
is a schematic plan showing a PKG of related art and
FIG. 9
is a schematic sectional view when viewed along a line A
8
-A
8
′ in FIG.
8
.
FIG. 10
is a partial sectional view showing a part equivalent to the position of a line C
8
-C
8
′ in
FIG. 8
when a semiconductor device using this PKG is mounted on a radiator fin of an amplifier and others.
Referring to
FIGS. 8
to
10
, as for this type of PKG
80
, a concave portion
86
is provided on each opposite side
88
,
89
in a first direction of a radiating substrate
81
, for fixing the radiating substrate
81
on a radiator fin
100
by a screw
13
. A chip mounting part
82
is provided in the approximately center of the radiating substrate
81
for directly mounting a chip
820
. The periphery of the chip mounting part
82
is surrounded by a ceramic side wall
83
brazed on the radiating substrate
81
. External leads
87
are led out from the side ends of the radiation substrate
81
in a direction perpendicular to the first direction.
For the semiconductor device, after the chip
820
is mounted on the radiation substrate
81
, the chip
820
and a part extended inside the ceramic side wall of the external lead
87
are bonded via a gold wire for example and the upper part of the side wall is airtightly sealed with a ceramic cover
90
for example.
The PKG
80
of the related art is formed by brazing and plating the radiating substrate
81
and the ceramic side wall
83
. That is, as materials different in a coefficient of thermal expansion of the radiating substrate
81
made of metal and the ceramic side wall
83
are heated and bonded, convex warpage
91
of a few tens micrometer is formed on the lower side of the radiating substrate
81
as shown in FIG.
9
.
Therefore, when the semiconductor device using the conventional type PKG
80
is fixed on the radiator fin
100
by the screw
13
as shown in
FIG. 10
, stress that levels the warpage
91
on the back is generated. There is a problem that at this time, superficial stress becomes maximum on the boundary of bonding
92
between the ceramic side wall
83
on the surface and the radiating substrate
81
and a crack
93
of the ceramic side wall
83
and an interface crack
94
between the ceramic side wall
83
and the radiating substrate
81
are easily made around the boundary.
SUMMARY OF THE INVENTION
A package according to the present invention includes a radiating substrate, a concave portion for a screw formed on a first side of the radiating substrate, a first groove formed on the first surface between a chip mounting portion and the concave portion of the radiating substrate, and a second groove on a second surface of the radiating substrate opposite to said first surface. Therefore, no crack is made on the ceramic side wall or on the boundary of bonding between the ceramic side wall and the radiating substrate when the PKG is mounted on a radiator fin of an amplifier and others using a screw.


REFERENCES:
patent: 3943556 (1976-03-01), Wilson
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4952999 (1990-08-01), Robinson et al.
patent: 4994897 (1991-02-01), Golubic et al.
patent: 5001547 (1991-03-01), Luigi
patent: 5901042 (1999-05-01), Ota et al.
patent: 5905634 (1999-05-01), Takeda et al.
patent: 6104464 (2000-08-01), Adachi et al.
patent: 6204553 (2001-03-01), Liu et al.
patent: 6252772 (2001-06-01), Allen
patent: 2537342 (1983-11-01), None
patent: 2132015 (1982-01-01), None
patent: 357050456 (1982-03-01), None
patent: 0922933802 (1996-04-01), None
patent: 11260960 (1998-03-01), None
patent: 2001085591 (2000-08-01), None

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