Package for semiconductor device and method of manufacturing...

Details Package for semiconductor device and method of manufacturing... Package for semiconductor device and method of manufacturing...

2011-06-21

2011-06-21

Dinh, Tuan T (Department: 2835)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S830000, C029S842000, C029S846000, C361S794000, C361S786000, C174S368000, C174S109000

Reexamination Certificate

active

07963031

ABSTRACT:
In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.

REFERENCES:
patent: 6297968 (2001-10-01), Nakai
patent: 6580036 (2003-06-01), Kim et al.
patent: 6683781 (2004-01-01), Ho et al.
patent: 6767616 (2004-07-01), Ooi et al.
patent: 6855177 (2005-02-01), Fujii et al.
patent: 7271348 (2007-09-01), Fan et al.
patent: 2002/0195700 (2002-12-01), Li
patent: 2005/0067713 (2005-03-01), Mutta et al.
patent: 2006/0214277 (2006-09-01), Saeki
patent: 2006/0215380 (2006-09-01), Lu et al.
patent: 2006/0283547 (2006-12-01), Yuri et al.
patent: 2007/0211403 (2007-09-01), Sievenpiper et al.
patent: 2008/0171441 (2008-07-01), Takemiya
patent: 11-68319 (1999-03-01), None

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