Package for semiconductor device

Details Package for semiconductor device Package for semiconductor device

1982-09-28

1985-11-05

Ramsey, Kenneth J.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

2281733, 357 80, H01L 2304, B23K 1134

Patent

active

045517452

ABSTRACT:
A package for a semiconductor device including a sealing frame with first and second opposing sides, the second side having a projected edge portion comprising a flash or a burr produced by blanking presswork of the sealing frame. A package substrate is fixed to the first side of the sealing frame while a sealing cap is fixed to the second side of the sealing frame by seam welding. A semiconductor element is fixed to the package substrate. The sealing cap is seam welded to the sealing frame at the projected edge portion of the sealing frame and by doing so the contact resistance is increased so that reliable welding can be carried out and so that unnecessary heating of portions of the package other than the required welded portion can be prevented.

REFERENCES:
patent: 1249532 (1917-12-01), Smith et al.
patent: 4461943 (1984-07-01), Beauvis

Affiliated with

Also associated with

Rating

Package for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-298176