Package for semiconductor beam lead devices

Details Package for semiconductor beam lead devices Package for semiconductor beam lead devices

1976-12-17

1978-07-04

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 74, 357 80, 174 52S, 174 5061, H01L 2348, H01L 2944, H01L 2952

Patent

active

040992004

ABSTRACT:
A beam lead packaged semiconductor structure having the beam leads of the beam lead semiconductor chip bonded directly to the thinned coplanar tips of lead frame leads which are supported on, and bonded to, an insulating support forming a portion of the package envelope and having substantially the same thermal coefficient expansion as the lead frame metal. The package is constructed by producing thinned coplanar lead tips integral with a lead frame structure, bonding each lead of a beam lead device to a thinned tip of a lead frame lead at a plurality of points, bonding ceramic covers of the package to both sides of the lead frame beam lead device to hermetically seal the package, with one cover being bonded to the thinned tips beneath the regions where the beam leads of the semiconductor chip are bonded to the thinned tips of the lead frame lead to rigidly support the chip in the package and then removing the lead frame from the outer ends of the lead frame leads and forming the outer portions of said leads to fit the desired socket configuration.

REFERENCES:
patent: 3436810 (1968-04-01), Kauffman
patent: 3594619 (1971-07-01), Kamoshida
patent: 3672034 (1972-06-01), Clark
patent: 3857993 (1974-12-01), Gregory
patent: 3869787 (1975-03-01), Umbach

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