Package for rugged electronics

Stock material or miscellaneous articles – All metal or with adjacent metals – Intermediate article

Patent

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Details

428598, 361412, 339 17N, H01K 718, H01R 909

Patent

active

045130647

ABSTRACT:
A substrate which serves as an element for building an electronic module for ordnance applications comprising a body portion, for receiving electronic components, and a plurality of tab means extending therefrom for interlocking with complementary tab means on another similar substrate. The tab means may extend from the top, bottom, and/or sides of the substrate, and serve to mechanically and electrically interconnect with complementary tab means or apertures on adjacent substrates to form an electronic module of high mechanical strength and reliability. Such an electronic module may be assembled from at least three substrates. Each substrate has at least two tab means on each side edge thereof.

REFERENCES:
patent: 2279864 (1942-04-01), Eide
patent: 2786969 (1957-03-01), Blitz
patent: 2816253 (1957-12-01), Blitz
patent: 2850681 (1958-09-01), Horton
patent: 2995686 (1961-08-01), Selvin
patent: 3066436 (1962-12-01), Schuh
patent: 3087096 (1963-04-01), Jorgensen
patent: 3379315 (1968-04-01), Broadwin
patent: 3522485 (1970-08-01), De Metrick
patent: 3614541 (1971-10-01), Farrand
patent: 3833840 (1974-09-01), Sinden
patent: 3855748 (1974-12-01), Thomas
patent: 4085433 (1978-04-01), Baranowski
patent: 4216523 (1980-08-01), Harford
patent: 4228483 (1980-10-01), Haury et al.
patent: 4283755 (1981-08-01), Tracy
Electronic Design, Nov. 9, 1960, p. 90, Fig. 39.
Electronics, Nov. 25, 1960, p. 93, Fig. 3.
Electronic Design, "Multi-layer Printed Circuits Take Any Geometric Shape", ec. 6, 1961, p. 59, article 259.
Electron-Technology, Jan. 1962, "Multi-layer Printed Circuit", p. 130.

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