Package for push-pull semiconductor devices

Wave transmission lines and networks – Automatically controlled systems – With control of equalizer and/or delay network

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 81, 357 74, 333 84M, H01L 3902, H01L 2302, H01L 2312

Patent

active

041077288

ABSTRACT:
A semiconductor package for containing two individual devices such that they may be externally connected in a push-pull relationship. Two transistors, each having an input and output pad are formed on the same dielectric wafer, in a spaced relationship with each other and a ground plane so as to form two separate transmission line paths. The transistors are wired either in a grounded emitter or grounded base configuration. A shunt inductor is formed by a metallized strip or lead bond from the collector of one transistor to the collector of the other transistor. This inductor reduces the influence of the parasitic capacitance in the equivalent output circuit of the transistors. Since the collectors of both transistors are at the same DC level it is not necessary to include a DC blocking capacitor in series with the inductor. This increases the reliability and the reproducibility of the circuit because bonding wires necessary in prior devices to connect the blocking capacitor in series with the output inductance is not necessary. This packaging technique increases the output impedance, decreases the internal losses, and increases the bandwidth when wired as a push-pull circuit.

REFERENCES:
patent: 3364400 (1968-01-01), Granberry
patent: 3489956 (1970-01-01), Yanai et al.
patent: 3555375 (1971-01-01), Hilbers
patent: 3559087 (1971-01-01), Goordman et al.
patent: 3713006 (1973-01-01), Litty et al.
patent: 3801938 (1974-04-01), Goshgarian
patent: 3869677 (1975-03-01), Belohoubek et al.
patent: 3886505 (1975-05-01), Jacobson
patent: 3908185 (1975-09-01), Martin
patent: 3996603 (1976-12-01), Smith
patent: 3999142 (1975-12-01), Presser et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Package for push-pull semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for push-pull semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for push-pull semiconductor devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1440114

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.