Package for optical semiconductor module

Details Package for optical semiconductor module Package for optical semiconductor module

1998-09-03

2001-02-13

Lee, John D. (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C257S684000, C257S692000

Reexamination Certificate

active

06186673

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus for optical communication including an optical semiconductor module.
2. Description of Related Art
When communication through an optical fiber is used for cable television, mobile communication and the like, a light transmission circuit for transmitting analog or digital signals through an optical fiber is required to operate at a high speed in a wide range.
An apparatus including an optical semiconductor module connected to an optical fiber is used for optical communication. Among optical semiconductor modules, a DFB laser module of butterfly type has input/output lines of electrical signals at two sides thereof. Then, its contour is suitable to be packaged on a high frequency circuit board.
FIG. 1
shows an example of a prior art package for an optical semiconductor module of the butterfly type
101
. A high frequency circuit board
104
, fixed on a metallic base
105
, has a hole for receiving the optical semiconductor module
101
of butterfly type therein. The optical semiconductor module
101
is connected to an optical fiber
102
, while input/output lines
106
thereof are provided at two sides and are connected electrically to a high frequency circuit on the circuit board
104
.
When a system is constructed, a key in system design is to provide a simple light transmission circuit at a low cost. A Fabry-Perot laser diode which can be produced at a lower cost is beginning to be used for transmitting light signals instead of an expensive DFB laser. A Fabry-Perot laser diode module has a coaxial contour, and the input/output line of electrical signals of such a module extends along a longitudinal direction thereof. However, it is not necessarily suitable to be mounted to a high frequency circuit board.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a package including an optical semiconductor module having good performance at high Lrequencies.
In a first aspect of the present invention, a package for optical semiconductor module comprises a base, a circuit board fixed to the base, and an optical semiconductor module. The module has an input/output pin thereof positioned so as to coincide with that of a signal input/output line provided on the circuit board. The input/output pin of the optical semiconductor module is connected electrically at the position to the signal input/output line of the circuit board. Thus, the input/output pin of the optical semiconductor module can be connected electrically to the signal input/output line of the circuit board at the shortest distance. An optical semiconductor is a term used to designate a semiconductor element which emits or receives a light signal, such as a laser diode, a light emitting diode, a photodiode or a composite device thereon.
In another aspect of the present invention, a package for an optical semiconductor module comprises a base, a circuit board fixed to the base, and an optical semiconductor module connected electrically to the optical semiconductor module. A longitudinal direction of the optical semiconductor module is oblique relative to the circuit board. Then, the circuit board can be provided below the optical semiconductor module. Thus, packaging density of the circuit is improved.
In a further aspect of the invention, a package for an optical semiconductor module comprises a base, an optical semiconductor module, and a circuit board fixed to the base and connected electrically to the optical semiconductor module. The circuit board extends to below the optical semiconductor module. Thus, packaging density of the circuit is improved.
An advantage of the present invention is that a package having an optical semiconductor module has good conversion efficiency from electrical to light signals.
Another advantage of the present invention is that a packaging efficiency on a circuit board is improved in a package having an optical semiconductor module.


REFERENCES:
patent: 5127073 (1992-06-01), Mulholland et al.
patent: 5539767 (1996-07-01), Nakanishi et al.
patent: 5596171 (1997-01-01), Harris et al.
patent: 5971628 (1999-10-01), Dona et al.
patent: 06163951 (1994-06-01), None
patent: 07244228 (1995-09-01), None

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