Package for optical semiconductor element and method for manufac

Details Package for optical semiconductor element and method for manufac Package for optical semiconductor element and method for manufac

1997-05-22

1998-09-08

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257432, H01L 310203

Patent

active

058048650

ABSTRACT:
A package for optical semiconductor device comprising a metallic frame having a side wall provided with an optical fiber-securing portion for securing an optical fiber to be introduced through the side wall, and a metallic bottom plate for mounting the optical semiconductor device thereon. The metallic frame is provided at a lower portion of the side wall thereof with securing parts for securing the package to a substrate, each securing part outwardly extending in a direction parallel with the metallic bottom plate. The level of bottom face of the metallic bottom plate is made lower than that of the bottom face of the securing parts. The securing parts are integrally formed with the metallic frame.

REFERENCES:
patent: 4834491 (1989-05-01), Aoki et al.
patent: 5011256 (1991-04-01), Johnson et al.
patent: 5047835 (1991-09-01), Chang
patent: 5127075 (1992-06-01), Althaus et al.
patent: 5132532 (1992-07-01), Watanabe

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