Package for optical semiconductor element

Details Package for optical semiconductor element Package for optical semiconductor element

2009-03-23

2011-11-08

Trinh, Hoa B (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257SE23192, C257S781000

Reexamination Certificate

active

08053803

ABSTRACT:
A package for an optical semiconductor element is provided. The package includes: a stem body having a sealing hole therein; and a lead pin having a glass sealing portion which is sealed with sealing glass in the sealing hole. Characteristic impedance of the glass sealing portion is adjusted to a given value. The characteristic impedance Zo is given by: Zo=(138/Er1/2)×log(D/d), where a hole diameter of the sealing hole is D, a wire diameter of the lead pint is d, and a dielectric constant of the sealing glass is Er, and the dielectric constant Er of the sealing glass is set by controlling an amount of bubble contained in the sealing glass.

REFERENCES:
patent: 4951011 (1990-08-01), Heckaman et al.
patent: 6074102 (2000-06-01), Oikawa
patent: 2003/0020149 (2003-01-01), Ogura et al.
patent: 2004/0138045 (2004-07-01), Komatsudani et al.
patent: 2007053252 (2007-01-01), None
patent: 2007-220843 (2007-08-01), None

Affiliated with

Also associated with

Rating

Package for optical semiconductor element does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for optical semiconductor element, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for optical semiconductor element will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4294774