Package for optical device

Details Package for optical device Package for optical device

1984-11-15

1987-05-05

Lee, John

350 9620, 357 68, 357 80, H01L 2944

Patent

active

046636528

ABSTRACT:
In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bonding pad by said solder layer, the optical device chip is die-bonded in a stable state.

REFERENCES:
patent: 3959522 (1976-05-01), Ladany et al.
patent: 4355321 (1982-10-01), Yeats
patent: 4445130 (1984-04-01), Poulain et al.
Yeat, R., Proceedings, Society of Photo-Optical Instruments Engineers (U.S.A.), "Long Wavelength Detectors for Optical Fiber Communications," vol. 272, pp. 22-26, (1981).
A. R. Clawson et al, Appl. Phys. Lett., vol. 32, (No. 9), p. 549, (1978).
Gendai Kogaku Sha, Basic Principle of Super LSI Electronics, vol. II, pp. 198-219, Original Title, "VLSI Electronics: Microstructure Science, Academic Press".
Shinko Denki Kogyo K.K. Catalog, "Optical Header Cap".
Patent Abstracts of Japan, Apr. 5, 1980.

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