Package for multielement electro-optical devices

Details Package for multielement electro-optical devices Package for multielement electro-optical devices

1976-08-02

1978-11-21

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 357 80, 361400, 361401, H01L 2302, H01L 2312, H01L 2316

Patent

active

041268822

ABSTRACT:
Disclosed is a semiconductor device package for a multielement electro-optical device. The package includes a base structure, a cover and an environmental seal. The cover is secured with screws to the base structure and sealed at this interface to provide an environmentally protected package. The base structure includes a base member and a fine geometry lead pattern substrate loosely attached to the base member internal to the package. Connector pins are mounted either in retainer blocks or in the substrate attached to the base. The multielement electro-optical device is mounted upon a support member and its elements electrically coupled to leads to provide for testing prior to incorporation into the package. The device and support member or members constitute a subassembly which is electrically coupled to the lead pattern of the package substrate. The package substrate may be a single substrate loosely mounted on the base member to provide a substantially stress-free package or a segmented substrate of which each segment is loosely attached to the base plate to provide even a more substantially stress-free package.

REFERENCES:
patent: 3713006 (1973-01-01), Litty et al.
patent: 3753054 (1973-08-01), Johnson
patent: 3908184 (1975-09-01), Anazawa et al.
patent: 4011575 (1977-03-01), Groves
patent: 4044374 (1977-08-01), Roberts et al.
patent: 4055725 (1977-10-01), Boynton

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