Package for mounting a semiconductor device

Stock material or miscellaneous articles – Composite – Of metal

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Details

428209, 428343, 428344, 428458, 428688, 428901, 361719, B32B 900

Patent

active

056654731

ABSTRACT:
A package for mounting a semiconductor device comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. The modulus of elasticity at 25.degree. C. of the adhesive layer is 10 kg/mm.sup.2 or less.

REFERENCES:
patent: 4374890 (1983-02-01), Shimizu
patent: 4456652 (1984-06-01), Konishi
patent: 4961987 (1990-10-01), Okuno
patent: 5467251 (1995-11-01), Katchmar
patent: 5510174 (1996-04-01), Litman

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