Stock material or miscellaneous articles – Composite – Of metal
Patent
1995-09-12
1997-09-09
Ryan, Patrick
Stock material or miscellaneous articles
Composite
Of metal
428209, 428343, 428344, 428458, 428688, 428901, 361719, B32B 900
Patent
active
056654731
ABSTRACT:
A package for mounting a semiconductor device comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. The modulus of elasticity at 25.degree. C. of the adhesive layer is 10 kg/mm.sup.2 or less.
REFERENCES:
patent: 4374890 (1983-02-01), Shimizu
patent: 4456652 (1984-06-01), Konishi
patent: 4961987 (1990-10-01), Okuno
patent: 5467251 (1995-11-01), Katchmar
patent: 5510174 (1996-04-01), Litman
Kato Yuka
Maeda Masakatsu
Miyahara Kenichiro
Okoshi Hideki
Okoshi Tokio
Ryan Patrick
Tokuyama Corporation
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