Package for mounting a semiconductor chip of ultra-high frequenc

Details Package for mounting a semiconductor chip of ultra-high frequenc Package for mounting a semiconductor chip of ultra-high frequenc

1988-04-22

1989-12-26

James, Andrew J.

357 80, 357 68, H01L 2302

Patent

active

048901555

ABSTRACT:
A semiconductor chip, which operates in a range of ultra-high frequency, is mounted on a package including an insulation layer on which input and output conductive patterns are formed. A metalized layer and via holes filled with conductive material are provided in the insulation layer to adjust the characteristic impedance of the conductive patterns.

REFERENCES:
patent: 4717948 (1988-01-01), Sakai et al.

Affiliated with

Also associated with

Rating

Package for mounting a semiconductor chip of ultra-high frequenc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for mounting a semiconductor chip of ultra-high frequenc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for mounting a semiconductor chip of ultra-high frequenc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1579777