Package for monolithic compound semiconductor (CSC) devices...

Details Package for monolithic compound semiconductor (CSC) devices... Package for monolithic compound semiconductor (CSC) devices...

2011-08-16

2011-08-16

Sandvik, Benjamin P (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S155000, C257S355000, C257S696000, C257SE23030, C257SE23031, C257SE23032, C257SE23033, C257SE21001, C438S123000

Reexamination Certificate

active

07999365

ABSTRACT:
A multichip module defining a dc to dc converter employs a monolithic chip containing at least two III-nitride switches (a monolithic CSC chip) mounted on a conductive lead frame. The CSC chip is copacked with an IC driver for the switches and with the necessary passives. The module defines a buck converter; a boost converter, a buck boost converter, a forward converter and a flyback converter. The drain, source and gate pads of the monolithic CSC chip are connected to a lead frame by solder or epoxy or by bumping attach and a conductive connector or wire bonds connect the switch terminal to lead frame.

REFERENCES:
patent: 2003/0090237 (2003-05-01), Shenai et al.
patent: 2003/0161111 (2003-08-01), Yoshida et al.
patent: 2005/0280163 (2005-12-01), Schaffer et al.
patent: 2006/0175627 (2006-08-01), Shiraishi
patent: 2007/0096299 (2007-05-01), Pavier
patent: 2008/0136390 (2008-06-01), Briere
patent: 2008/0224300 (2008-09-01), Otremba
patent: 2009/0103272 (2009-04-01), Watanabe
patent: WO 2007/049788 (2007-05-01), None

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