Package for light emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S088000, C257S098000, C257S099000, C257S918000, C385S014000, C385S129000

Reexamination Certificate

active

08003997

ABSTRACT:
The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

REFERENCES:
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patent: 5994212 (1999-11-01), Arakawa et al.
patent: 6809261 (2004-10-01), Ng et al.
patent: 6936855 (2005-08-01), Harrah
patent: 2004/0065894 (2004-04-01), Hashimoto et al.
patent: 2004/0095738 (2004-05-01), Juang
patent: 2004/0099874 (2004-05-01), Chang et al.
patent: 2004/0222433 (2004-11-01), Mazzochette et al.
patent: 0525644 (1993-02-01), None
patent: 1467414 (2004-10-01), None
patent: 8-008463 (1996-01-01), None
patent: 10-012927 (1998-01-01), None
patent: 2003-008073 (2003-01-01), None
patent: 2004-39691 (2004-02-01), None
patent: 2004-311791 (2004-11-01), None
Machine English translation of JP-08-008463.
Machine English translation of JP-10-012927.
Machine English translation of JP-2003-008073.
Machine English translation of JP-2004-039691.
Machine English translation of JP-2004-311791.

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